| QS-9000 and ISO-9002 UL94V-0 Certified PCBs |
 |
| Single/Double/Up to 30 Layer PCBs |
|
| Rigid Flex/Rigid/Flex PCBs |
|
| RoHS Compliant PCBs |
|
| CAD/CAM Support |
|
| Quick On Time Turnaround... To Standard Production Delivery |
|
|
Standard Delivery |
Production Delivery |
|
| 1-6 Layer |
1 - 5 day |
2 - 6 week |
|
| 7-8 Layer |
2 - 5 day |
2 - 6 week |
|
| 9-12 Layer |
3 - 5 day |
2 - 6 week |
|
| 13-30 Layer |
5 - 10 day |
3 - 6 week |
|
|
| Materials |
|
| FR4 (standard & high Tg) |
Getek |
Taconic |
|
| Isola 410 |
Arlon |
Teflon |
|
| Rogers |
Bismalemide Trazene |
Polyimdie |
|
| CEM 1 & 3 |
Cyanate Esters |
Ployclad |
|
|
| Plating Surfaces |
|
| Leaded Solder (HASL) |
Immersion Silver (IAg, RoHS) |
Hard Gold (ENG, RoHS) |
|
| Lead Free Solder (HASL, RoHS) |
Immersion Gold (ENIG, RoHS) |
Bondable Soft Gold (Au, RoHS) |
|
| Immersion Tin (ISn, RoHS) |
Organic Solder Preservative (OSP, RoHS) |
|
|
|
| Standard Capabilities |
|
| Gold Fingers |
Edge Beveling/Milling/Plating |
Laser Drilling |
|
| Dielectrical Thickness |
Carbon Ink Pads
|
Metal Core |
|
| Control Impedance |
Jump Scoring |
Microvias |
|
| Buried/Blind vias |
Peelable Mask |
Plasma Etchback |
|
| Counter Bore/Sink |
Cutouts/Slots |
Heat Sink |
|
| BGA |
Plugged Vias (with solder mask only)
|
µBGA |
|
|
| Maximum Panel Size |
Negotiable |
|
|
| Board Thickness |
0.008" - 0.300" |
|
|
| Trace/Space |
0.004" |
|
|
| Smallest Finished Hole |
0.008" |
|
|
| SMT Pitch |
0.008" |
|
|
| Aspect Ratio |
15 to 1 |
|
|
| Copper Weight |
1/8 oz. - 12 oz. |
|
|
|
| Solder Mask Type |
|
| LPI |
Dry Film |
SR Series |
|
|
| Variety of Solder Mask & Silk Screen Colors |
|
| Electrical Testing |
|
| 100% Continuity Testing |
Net List Testing |
Clamp Shell Testing |
|
|
| Routing |
| Individual Boards |
V-Score Boards |
|
| Tab & Route Boards |
V-Score Tab & Route Boards |
|
